Gas and Chemical Delivery Modules are Critical to Manufacturing of ICs

The fabrication of advanced integrated circuits (ICs) continue to increase in complexity, requiring an excess of 300 steps today. These steps are performed on a wafer, generally made of silicon, and certain of the steps are repeated numerous times. All of these steps are performed using semiconductor capital equipment, which generally include four to five major modules. Steps used to deposit and remove, or etch, insulating and conductive layers on a wafer typically employ specialty gases while steps used to clean, strip and polish a wafer typically require specialty chemicals. Precise blending and delivery of these gases and chemicals is essential to achieving acceptable yields in the IC manufacturing process.